PILOT PROGRAMME 2027
$ open /work/galvani-one
DRV-007
Light writes.
Copper grows.
FABRICATION SYSTEMS · PILOT PROGRAMME 2027
Scroll runs the process. Backwards works too.
SCROLL
ACT 01 · THE GAPPLAN VIEW
Scale, collapsed.
The process inside advanced electronics needs a building. This one needs a wall socket.
ACT 02 · THE LOOPSTEP 01/08
Seed goes down.
A whisper of metal across the whole surface. Everything after grows from this.
ACT 02 · THE LOOPSTEP 02/08
Film laminates on.
Dry photoresist, rolled flat. It is about to be told where to stay.
ACT 02 · THE LOOPSTEP 03/08
Light writes lines.
A projector sweeps the layer once, no mask. Change the design, change the light.
ACT 02 · THE LOOPSTEP 04/08
Develop opens channels.
Unwritten film washes away, leaving a mould of the circuit, 25 µm wide.
ACT 02 · THE LOOPSTEP 05/08
Copper grows in.
Plated up from the seed, every channel at once. Grown, not carved.
ACT 02 · THE LOOPSTEP 06/08
Film strips away.
The mould has done its work. Only the circuit stands.
ACT 02 · THE LOOPSTEP 07/08
Via-posts rise.
A thinner film, two openings written by the same light, copper grown again, one storey up. Nothing is drilled.
ACT 02 · THE LOOPSTEP 08/08
Flood, cut flat.
Dielectric buries the layer; a planar cut takes it dead flat. Ready to go again.
ACT 03 · STACKLOOP ×16
Run it again.
The same loop, sixteen times. No core, no drills, no press: one grown piece.
ACT 04 · ANY SHAPEOUTLINE + Z
No panel rules.
Any outline, variable thickness, and layer count that follows the circuit: four layers where the board is simple, twenty under the processor. One object, priced by its densest square centimetre.
ACT 05 · GROWN, NOT PLACEDSEQ A
Silicon moves in.
A bare die settles into a cavity; posts grow down to its pads. The package is the board.
ACT 05 · GROWN, NOT PLACEDSEQ B
Copper learns springs.
Strip the dielectric from a grown beam and it stands free. Wiring becomes mechanism.
ACT 05 · GROWN, NOT PLACEDSEQ C
The screen is the board.
Displays fabricated as the board’s own top layer: dot-matrix and arbitrary-shape segments, designed for the 60–100 PPI class. The screen is not attached to the board. It is the board.
ACT 06 · THE MACHINEGALVANI ONE
The whole machine.
Everything the loop needs, on 1.5 m of bench.
DESIGNED FOR 25 µm LINES · 16-LAYER CORELESS · TERRACED 4→20 ON ONE BOARD · ANY OUTLINE, VARIABLE THICKNESS · SILICON EMBEDDED IN-BOARD · ON-BOARD DISPLAYS, 60–100 PPI CLASS · SEALED CARTRIDGES, ZERO EFFLUENT
Design targets pending first-article validation. That is as much as we publish.
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$ cat /work/galvani-one/index
007 · FABRICATION SYSTEMS PILOT PROGRAMME 2027
Galvani One.
- Additive copper · fully dense, reflow-ready
- Designed for 25 µm lines · terraced 4→20 layers on one board
- Any outline · variable thickness
- Silicon embedded in-board · displays grown as the top layer
- Sealed cartridge chemistry · zero effluent
ACT 07 · APPLY
$ apply --pilot
Pilot programme/apply
A small number of Galvani One benches ship to partner labs in 2027. Tell us what you would grow on one. Selected applicants receive the full technical envelope under NDA.
APPLICATION RECEIVED · REF GLV-0000
We'll read this ourselves.
If the use case fits the pilot's envelope, we reply with a technical questionnaire. If it doesn't, we say so.